Re: [PATCH 3/3] bonding: Apply bonding settings when setting up bonding device

[Thomas Graf <tgraf redhat com>]

On Wed, 2011-11-09 at 12:16 -0600, Dan Williams wrote:
> On Wed, 2011-11-09 at 11:22 +0100, Thomas Graf wrote:
> > Adds a new function nm_system_apply_bonding_config() which applies
> > the parameters specified in the NMSettingBond object via sysfs.
> > 
> > Calls that function after creating/updating the bonding master
> > device.
> > 
> > If a parameter is not specified in the ifcfg the parameter will be
> > re-initialized to the default value. This may overwrite changes
> > which have been done manually via sysfs but it is the only reliable
> > way of setting up the bond.
> > 
> > Supported parameters for now:
> >  - mode (default: balance-rr)
> >  - miimon (default: 100)
> >  - updelay (default: 0)
> >  - downdelay (default: 0)
> >  - arp_interval (default: 0)
> >  - arp_ip_target (default: none)
> 
> Hmm, is there no way to do this via netlink yet?

No, it has not been implemented yet. Even when it gets implemented,
we will still need this code for backwards compatibility.

While on this subject, a bonding alternative called "team" is currently
being merged, developed by Jiri Pirko. It's not replacing bonding but
offers an alternative implementation. It is likely the future of bonding
long term.